CHIPNOBO
Semiconductor Replacement Engineering & Supply Continuity
Memory
PRODUCT DATASHEET
ChipNobo MPN
NB22EF08GP-JQLA2
GLOBAL BRAND CROSS-REFERENCE
ISSI, Integrated Silicon Solution Inc
8GB, 100 BALL FBGA, 3.3V, ROHS,
IS22EF08GP-JQLA2
- High-reliability design
- Long-term stable supply
- RoHS compliant
1. PRODUCT POSITIONING
NB22EF08GP-JQLA2 is a product identity corresponding to the reference product IS22EF08GP-JQLA2. This document presents the available product specifications, mechanical/package information and compatibility summary for engineering and procurement reference.
This document is a product information. Compatibility conclusions should be read together with the applicable Cross-Reference Identification (CID) rule, package/pin verification and engineering review record.
| 2. TECHNICAL SPECIFICATION COMPARISON (core parameters) | |||
|---|---|---|---|
| Parameter | ISSI, Integrated Silicon Solution Inc IS22EF08GP-JQLA2 | ChipNobo NB22EF08GP-JQLA2 | Match |
| Part Status | Active | Active | ✓ |
| Mounting Type | Surface Mount | Surface Mount | ✓ |
| Grade | Automotive | Automotive | ✓ |
| Memory Type | Non-Volatile | Non-Volatile | ✓ |
| Clock Frequency | 200 MHz | 200 MHz | ✓ |
| Qualification | AEC-Q100 | AEC-Q100 | ✓ |
| Voltage - Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V | ✓ |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | ✓ |
| Memory Format | FLASH | FLASH | ✓ |
| Package / Case | 100-LBGA | 100-LBGA | ✓ |
| Memory Size | 64Gbit | 64Gbit | ✓ |
| Memory Organization | 8G x 8 | 8G x 8 | ✓ |
| Technology | FLASH - NAND (MLC) | FLASH - NAND (MLC) | ✓ |
| Memory Interface | eMMC_5.1 | eMMC_5.1 | ✓ |
| Supplier Device Package | 100-LFBGA (14x18) | 100-LFBGA (14x18) | ✓ |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ✓ |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) | ✓ |