CHIPNOBO
Semiconductor Replacement Engineering & Supply Continuity
Memory
PRODUCT DATASHEET
ChipNobo MPN
NB16G31M-51BIN
GLOBAL BRAND CROSS-REFERENCE
Alliance Memory, Inc.
IC FLASH 128GBIT EMMC 153FBGA
ASFC16G31M-51BIN
- High-reliability design
- Long-term stable supply
- RoHS compliant
1. PRODUCT POSITIONING
NB16G31M-51BIN is a product identity corresponding to the reference product ASFC16G31M-51BIN. This document presents the available product specifications, mechanical/package information and compatibility summary for engineering and procurement reference.
This document is a product information. Compatibility conclusions should be read together with the applicable Cross-Reference Identification (CID) rule, package/pin verification and engineering review record.
| 2. TECHNICAL SPECIFICATION COMPARISON (core parameters) | |||
|---|---|---|---|
| Parameter | Alliance Memory, Inc. ASFC16G31M-51BIN | ChipNobo NB16G31M-51BIN | Match |
| Part Status | Active | Active | ✓ |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | ✓ |
| Mounting Type | Surface Mount | Surface Mount | ✓ |
| Memory Type | Non-Volatile | Non-Volatile | ✓ |
| Clock Frequency | 200 MHz | 200 MHz | ✓ |
| Voltage - Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V | ✓ |
| Memory Format | FLASH | FLASH | ✓ |
| Package / Case | 153-VFBGA | 153-VFBGA | ✓ |
| Memory Size | 128Gbit | 128Gbit | ✓ |
| Memory Organization | 16G x 8 | 16G x 8 | ✓ |
| Technology | FLASH - NAND (MLC) | FLASH - NAND (MLC) | ✓ |
| Supplier Device Package | 153-FBGA (11.5x13) | 153-FBGA (11.5x13) | ✓ |
| Memory Interface | eMMC_5.1 | eMMC_5.1 | ✓ |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ✓ |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) | ✓ |
| 3. SUPPLY & LIFECYCLE | |
|---|---|
| ChipNobo Number | NB16G31M-51BIN |
| Lifecycle status | Active |
| NRND | No |
| EOL | No |
| PCN monitor | No |
| Last buy date | No Deadline |
| Alternate availability | Sufficient |