CHIPNOBO
Semiconductor Replacement Engineering & Supply Continuity
Memory
PRODUCT DATASHEET
ChipNobo MPN
NB638GU6QB12I
GLOBAL BRAND CROSS-REFERENCE
Winbond Electronics
IC DRAM 8GBIT PAR 96VFBGA
W638GU6QB12I
- High-reliability design
- Long-term stable supply
- RoHS compliant
1. PRODUCT POSITIONING
NB638GU6QB12I is a product identity corresponding to the reference product W638GU6QB12I. This document presents the available product specifications, mechanical/package information and compatibility summary for engineering and procurement reference.
This document is a product information. Compatibility conclusions should be read together with the applicable Cross-Reference Identification (CID) rule, package/pin verification and engineering review record.
| 2. TECHNICAL SPECIFICATION COMPARISON (core parameters) | |||
|---|---|---|---|
| Parameter | Winbond Electronics W638GU6QB12I | ChipNobo NB638GU6QB12I | Match |
| Mounting Type | Surface Mount | Surface Mount | ✓ |
| Part Status | Not For New Designs | Not For New Designs | ✓ |
| Memory Type | Volatile | Volatile | ✓ |
| Memory Interface | Parallel | Parallel | ✓ |
| Write Cycle Time - Word, Page | 15ns | 15ns | ✓ |
| Access Time | 20 ns | 20 ns | ✓ |
| Memory Format | DRAM | DRAM | ✓ |
| Operating Temperature | -40°C ~ 95°C (TC) | -40°C ~ 95°C (TC) | ✓ |
| Memory Size | 8Gbit | 8Gbit | ✓ |
| Package / Case | 96-VFBGA | 96-VFBGA | ✓ |
| Clock Frequency | 800 MHz | 800 MHz | ✓ |
| Technology | SDRAM - DDR3L | SDRAM - DDR3L | ✓ |
| Voltage - Supply | 1.283V ~ 1.45V | 1.283V ~ 1.45V | ✓ |
| Memory Organization | 512M x 16 | 512M x 16 | ✓ |
| Supplier Device Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | ✓ |
| 3. SUPPLY & LIFECYCLE | |
|---|---|
| ChipNobo Number | NB638GU6QB12I |
| Lifecycle status | Not For New Designs |
| NRND | No |
| EOL | No |
| PCN monitor | No |
| Last buy date | No Deadline |
| Alternate availability | Sufficient |