CHIPNOBO
Semiconductor Replacement Engineering & Supply Continuity
Memory
PRODUCT DATASHEET
ChipNobo MPN
NB66AP6NBQAGJ
GLOBAL BRAND CROSS-REFERENCE
Winbond Electronics
IC DRAM 1GBIT LVSTL 200TFBGA
W66AP6NBQAGJ
- High-reliability design
- Long-term stable supply
- RoHS compliant
1. PRODUCT POSITIONING
NB66AP6NBQAGJ is a product identity corresponding to the reference product W66AP6NBQAGJ. This document presents the available product specifications, mechanical/package information and compatibility summary for engineering and procurement reference.
This document is a product information. Compatibility conclusions should be read together with the applicable Cross-Reference Identification (CID) rule, package/pin verification and engineering review record.
| 2. TECHNICAL SPECIFICATION COMPARISON (core parameters) | |||
|---|---|---|---|
| Parameter | Winbond Electronics W66AP6NBQAGJ | ChipNobo NB66AP6NBQAGJ | Match |
| Part Status | Active | Active | ✓ |
| Mounting Type | Surface Mount | Surface Mount | ✓ |
| Memory Type | Volatile | Volatile | ✓ |
| Operating Temperature | -40°C ~ 105°C (TC) | -40°C ~ 105°C (TC) | ✓ |
| Memory Size | 1Gbit | 1Gbit | ✓ |
| Memory Format | DRAM | DRAM | ✓ |
| Memory Organization | 64M x 16 | 64M x 16 | ✓ |
| Access Time | 3.6 ns | 3.6 ns | ✓ |
| Technology | SDRAM - Mobile LPDDR4 | SDRAM - Mobile LPDDR4 | ✓ |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.06V ~ 1.17V, 1.7V ~ 1.95V | ✓ |
| Package / Case | 200-TFBGA | 200-TFBGA | ✓ |
| Supplier Device Package | 200-TFBGA (10x14.5) | 200-TFBGA (10x14.5) | ✓ |
| Memory Interface | LVSTL_11 | LVSTL_11 | ✓ |
| Write Cycle Time - Word, Page | 18ns | 18ns | ✓ |
| Clock Frequency | 1.867 GHz | 1.867 GHz | ✓ |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ✓ |
| 3. SUPPLY & LIFECYCLE | |
|---|---|
| ChipNobo Number | NB66AP6NBQAGJ |
| Lifecycle status | Active |
| NRND | No |
| EOL | No |
| PCN monitor | No |
| Last buy date | No Deadline |
| Alternate availability | Sufficient |