NB032GBE-T740

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Global Brand Reference

Product type
Memory
Description
IC FLSH 256GBIT EMMC 5.1 153FBGA
Original MPN
FEMC032GBE-T740
Manufacturer
Flexxon Pte Ltd

ChipNobo MPN

NB032GBE-T740

  • High-reliability design
  • Long-term stable supply
  • RoHS compliant

Technical specification comparison (core parameters)

Parameter Flexxon Pte LtdFEMC032GBE-T740 ChipNoboNB032GBE-T740 Match
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Part Status Active Active
Mounting Type Surface Mount Surface Mount
Programmable Not Verified Not Verified
Memory Type Non-Volatile Non-Volatile
Clock Frequency 200 MHz 200 MHz
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V
Memory Format FLASH FLASH
Package / Case 153-VFBGA 153-VFBGA
Memory Size 256Gbit 256Gbit
Memory Organization 32G x 8 32G x 8
Technology FLASH - NAND (TLC) FLASH - NAND (TLC)
Supplier Device Package 153-FBGA (11.5x13) 153-FBGA (11.5x13)
Memory Interface eMMC_5.1 eMMC_5.1
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)

Supply & lifecycle

Lifecycle status Active
NRND No
EOL No
PCN monitor No
Last buy date No Deadline
Alternate availability Sufficient
Application areas
AI Server GPU Server
AI Accelerator Server Data Center Switch
Laptop Notebook Smartphone
ADAS Camera System Smart Cockpit
5G Base Station Industrial Computer
Semiconductor Equipment Medical Imaging Equipment

Compatibility verification

Package Match
Pin Match
Electrical Match
Operating Range Match
Qualification Match
Pin-to-pin Compatible

Pin-to-Pin Replacement Solutions

100% Pin-to-Pin Compatible • Same Package • Same Key Electrical Parameters • Same Application

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